Detlef Bonfert

发表

ESD Susceptibility of Submicron Air Gaps

Heinrich Wolf, Horst A. Gieser, Detlef Bonfert, 2006, Microelectron. Reliab..

Contact resistance in Polytriarylamine based organic transistors

Paul Svasta, Detlef Bonfert, Andreea Bonea, 2011, Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE).

A novel micropump driver used in environmental sensor applications

Linus Maurer, Doris Schmitt-Landsiedel, Detlef Bonfert, 2016, 2016 IEEE SENSORS.

A SPICE model for electroluminescent foils

Ciprian Ionescu, Detlef Bonfert, Florin Draghici, 2015, 2015 38th International Spring Seminar on Electronics Technology (ISSE).

Transient-induced latch-up test setup for wafer-level and package-level

M. Frank, Heinrich Wolf, Horst A. Gieser, 2006, Microelectron. Reliab..

Optimization of a heater geometry for flexible gas sensor applications

Ciprian Ionescu, Paul Svasta, Detlef Bonfert, 2013, Proceedings of the 36th International Spring Seminar on Electronics Technology.

Analysis of planar inductors on flexible substrates for RFID antennas

Ciprian Ionescu, Paul Svasta, Detlef Bonfert, 2010, 33rd International Spring Seminar on Electronics Technology, ISSE 2010.

FFT based investigations on light flicker in new lighting systems

Ciprian Ionescu, Detlef Bonfert, Mihai Dima, 2016, 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME).

Flicker distortion power factor analysis in lighting LED's

Ciprian Ionescu, Detlef Bonfert, Mihai Dima, 2017, 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME).

3D Integration of CMOS transistors with ICV-SLID technology

Peter Ramm, Armin Klumpp, Josef Weber, 2005 .

Investigation on thermal properties of substrates for printed electronics

Ciprian Ionescu, Detlef Bonfert, Mihai Branzei, 2014, Proceedings of the 2014 37th International Spring Seminar on Electronics Technology.

Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending

Karlheinz Bock, Christof Landesberger, Detlef Bonfert, 2015, 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME).

Pulsed behavior of polymer protection devices

Ciprian Ionescu, Karlheinz Bock, Paul Svasta, 2009, 2009 32nd International Spring Seminar on Electronics Technology.

Low cost, rigid to flex interposer using a spray coated intrinsically conductive polymer in a roll to-roll process

Karlheinz Bock, Detlef Bonfert, Indranil Bose, 2014, 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME).

Pulsed stress behavior of platinum thin films

Ciprian Ionescu, Karlheinz Bock, Paul Svasta, 2010, 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME).