Lin Ke

Electromigration-induced Kirkendall voids at the Cu∕Cu3Sn interface in flip-chip Cu∕Sn∕Cu joints

Y. C. Chuang, J. T. Chen, J. T. Chen, 2007 .

Study of electromigration-induced Cu consumption in the flip-chip Sn∕Cu solder bumps

Y. C. Chuang, S. Wang, C. Y. Liu, 2006 .