S.P. Hui

Arrays of optoelectronic switching nodes comprised of flip-chip-bonded MQW modulators and detectors on silicon CMOS circuitry

L.A. D'Asaro, B.T. Tseng, D.A.B. Miller, 1996, IEEE Photonics Technology Letters.

GaAs MQW modulators integrated with silicon CMOS

D. Kossives, L.A. D'Asaro, L. Chirovsky, 1995, IEEE Photonics Technology Letters.

1-Gb/s two-beam transimpedance smart-pixel optical receivers made from hybrid GaAs MQW modulators bonded to 0.8 μm silicon CMOS

D. Kossives, T. K. Woodward, L.A. D'Asaro, 1996, IEEE Photonics Technology Letters.

3-D integration of MQW modulators over active submicron CMOS circuits: 375 Mb/s transimpedance receiver-transmitter circuit

D. Kossives, T. K. Woodward, L.A. D'Asaro, 1995, IEEE Photonics Technology Letters.

Clocked-sense-amplifier-based smart-pixel optical receivers

D. Kossives, T. K. Woodward, L. Chirovsky, 1996, IEEE Photonics Technology Letters.

Optoelectronic VLSI switching chip with greater than 4000 optical I/O based on flip chip bonding of GaAs-AlGaAs MQW modulators and detectors to silicon CMOS

D. Kossives, L.A. D'Asaro, R.A. Novotny, 1996, Summaries of papers presented at the Conference on Lasers and Electro-Optics.

3-D integration of MQW SEED detectors and modulators over active sub-micron CMOS circuits: Application to a 2KBit parallel photonic page buffer

D. Kossives, L.A. D'Asaro, D.A.B. Miller, 1995, LEOS '95. IEEE Lasers and Electro-Optics Society 1995 Annual Meeting. 8th Annual Meeting. Conference Proceedings.