R.C. Jaeger

发表

Fundamentals of delamination initiation and growth in flip chip assemblies

P. Lall, M.K. Rahim, R. Jaeger, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Characterization of die stresses in flip chip on laminate assemblies using

P. Lall, M.K. Rahim, R. Jaeger, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Low temperature threshold behavior of depletion mode devices—Characterization and simulation

R. Jaeger, F. Gaensslen, J.J. Walker, 1977, 1977 International Electron Devices Meeting.

Low-frequency noise characteristics of UHV/CVD epitaxial Si- and SiGe-base bipolar transistors

J. Babcock, J. Cressler, D. Harame, 1996, IEEE Electron Device Letters.

Reliability of flip chip assemblies subjected to extreme low temperatures

P. Lall, M. Strickland, J.C. Suhling, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Characterization of the Temperature Dependence of the Piezoresistive Coefficients of Silicon From ${-}150\,^{\circ}$C to ${+}125\,^{\circ}$C

Chun-Hyung Cho, R. Jaeger, J. Suhling, 2008, IEEE Sensors Journal.

Simulation of impurity freezeout through numerical solution of Poisson's equation with application to MOS device behavior

R. Jaeger, F. Gaensslen, F.H. Gaensslen, 1980, IEEE Transactions on Electron Devices.

High heat flux cooling for silicon-on-silicon packaging

R. Jaeger, J. Goodling, C. Ellis, 1989, Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

The lateral punch-through transistor

R.C. Jaeger, B.M. Wilamowski, 1982, IEEE Electron Device Letters.

Measurement of thermally induced die stresses in flip chip on laminate assemblies

P. Lall, M.K. Rahim, R.W. Johnson, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Temperature dependence of latchup in CMOS circuits

R.C. Jaeger, J.G. Dooley, 1984, IEEE Electron Device Letters.

Characterization of the Temperature Dependence of the Pressure Coefficients of n- and p-Type Silicon Using Hydrostatic Testing

Chun-Hyung Cho, A. Mian, R. Jaeger, 2008, IEEE Sensors Journal.

Die stress characterization in flip chip on laminate assemblies

P. Lall, M.K. Rahim, R. Jaeger, 2005, IEEE Transactions on Components and Packaging Technologies.

Simple analytical models for the temperature dependent threshold behavior of depletion-mode devices

R. Jaeger, F. Gaensslen, F.H. Gaensslen, 1979, IEEE Transactions on Electron Devices.

Re-entrant cavity heat sinks formed by anisotropic etching and silicon direct wafer bonding

R.C. Jaeger, C.D. Ellis, J.S. Goodling, 1992, [1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

CMOS stress sensor circuits using piezoresistive field-effect transistors (PIFETs)

R. Ramani, R. Jaeger, J. Suhling, 1995, Digest of Technical Papers., Symposium on VLSI Circuits..

CMOS stress sensors on [100] silicon

R. Ramani, R. Jaeger, J. Suhling, 2000, IEEE Journal of Solid-State Circuits.

Experimental characterization of the temperature dependence of the piezoresistive coefficients of silicon

R. Jaeger, J. Suhling, J.C. Suhling, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

A 5GHz Series Coupled BiCMOS Quadrature VCO with Wide Tuning Range

V. Kakani, R.C. Jaeger, F.F. Dai, 2006, 2006 Bipolar/BiCMOS Circuits and Technology Meeting.

Continuous In-Situ Die Stress Measurements During Thermal Cycling Accelerated Life Testing

P. Lall, M.K. Rahim, R. Jaeger, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.