Jun He

Wirebond reliability in IGBT-power modules: application of high resolution strain and temperature mapping

M. C. Shaw, V. Mehrotra, M. S. Dadkhah, 1999, 11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312).

Direct Measurements of Thermal Stress Distributions in Large Die Bonds for Power Electronics

David R. Clarke, Brian N. Cox, M. C. Shaw, 1998 .

Thermal design and measurements of IGBT power modules: transient and steady state

V. Mehrotra, M. C. Shaw, V. Mehrotra, 1999, Conference Record of the 1999 IEEE Industry Applications Conference. Thirty-Forth IAS Annual Meeting (Cat. No.99CH36370).