Y.K. Joshi

Fluid-to-fluid spot-to-spreader (F2/S2) hybrid heat sink for integrated chip-level and hotspot-level thermal management

Y. Joshi, A. Fedorov, C. Green, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Parametric thermal modeling of 3D stacked chip electronics with interleaved solid heat spreaders

Y. Joshi, D. Gerlach, Y.K. Joshi, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Thermal issues in next-generation integrated circuits

S. Gurrum, S. Suman, Y. Joshi, 2004, IEEE Transactions on Device and Materials Reliability.

Development of a prototype thermal management solution for 3-D stacked chip electronics by interleaved solid spreaders and synthetic jets

D. Gerty, A. Glezer, Y.K. Joshi, 2007, 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).

Numerical simulation of electron transport through constriction in a metallic thin film

K. Ramakrishna, S. Gurrum, Y. Joshi, 2004, IEEE Electron Device Letters.

Performance assessment of thermoelectric coolers for use in high temperature electronics applications

Y.K. Joshi, K.A. Moores, G. Miller, 1999, Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407).

Energy efficient thermal management of electronic components using solid-liquid phase change materials

Y. Joshi, Y.K. Joshi, Dong-won Yoo, 2004, IEEE Transactions on Device and Materials Reliability.

Parametric thermal modeling of heat transfer in handheld electronic devices

Jaeho Lee, Y. Joshi, Jaeho Lee, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.