Paul W. Mertens

Fundamental study of the removal mechanisms of nano-sized particles using brush scrubber cleaning

Jan Fransaer, M. Heyns, Kaidong Xu, 2005 .

A Novel Resist and Post-Etch Residue Removal Process Using Ozonated Chemistry

D. Martin Knotter, Stefan De Gendt, Rita Vos, 1998 .

Poly-Silicon Wet Removal for Replacement Gate Integration Scheme: Impact of Process Parameters on the Removal Rate

Anabela Veloso, Farid Sebaai, Katia Devriendt, 2010 .

Alkaline cleaning of silicone wafers: additives for the prevention of metal contamination

Bernd O. Kolbesen, Andreas Martin, W. Hub, 1999 .

Strength analysis of EUV-exposed photo resists by AFM at 40nm half pitch and below

Roel Gronheid, Gustaf Winroth, Tae-Gon Kim, 2012 .

Germanium MOSFET Devices: Advances in Materials Understanding, Process Development, and Electrical Performance

Geert Hellings, Jerome Mitard, Marc Heyns, 2008 .

Observation of critical gate oxide thickness for substrate-defect related oxide failure

Marc Heyns, Michel Houssa, Jan Vanhellemont, 1999 .

Ultra-thin gate oxide yield and reliability

Marc Meuris, Bert Vermeire, M. Depas, 1994, Proceedings of 1994 VLSI Technology Symposium.