Ryuta Furuya

Next Generation Panel-Scale RDL with Ultra Small Photo Vias and Ultra-Fine Embedded Trenches for Low Cost 2.5D Interposers and High Density Fan-Out WLPs

Fuhan Liu, Chandrasekharan Nair, Venky Sundaram, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Design and demonstration of large 2.5D glass interposer for high bandwidth applications

Rao Tummala, Venky Sundaram, Vanessa Smet, 2014, IEEE CPMT Symposium Japan 2014.

Demonstration of 2µm RDL wiring using dry film photoresists and 5µm RDL via by projection lithography for low-cost 2.5D panel-based glass and organic interposers

Rao Tummala, Fuhan Liu, Venky Sundaram, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Design and Demonstration of Micro-Mirrors and Lenses for Low Loss and Low Cost Single-Mode Fiber Coupling in 3D Glass Photonic Interposers

Rao Tummala, Fuhan Liu, Venky Sundaram, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Design and Demonstration of a 2.5-D Glass Interposer BGA Package for High Bandwidth and Low Cost

Rao Tummala, Chandrasekharan Nair, Venky Sundaram, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Design, Modeling, Fabrication and Characterization of 2–5- $\mu \text{m}$ Redistribution Layer Traces by Advanced Semiadditive Processes on Low-Cost Panel-Based Glass Interposers

Fuhan Liu, Chandrasekharan Nair, Venky Sundaram, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.