Yitong Liu

Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE(+) dual-cure polymer

Paolo Bettotti, Kristinn B. Gylfason, Farizah Saharil, 2013 .

Batch Transfer of Radially Expanded Die Arrays for Heterogeneous Integration Using Different Wafer Sizes

G. Stemme, F. Forsberg, T. Haraldsson, 2012, Journal of Microelectromechanical Systems.

Functional off‐stoichiometry thiol‐ene‐epoxy thermosets featuring temporally controlled curing stages via an UV/UV dual cure process

Mats Johansson, Tommy Haraldsson, Wouter van der Wijngaart, 2014 .

SUPERIOR DRY BONDING OF OFF-STOICHIOMETRY THIOL-ENEEPOXY (OSTE(+)) POLYMERS FOR HETEROGENEOUS MATERIALLABS-ON-CHIP

Laurent Francis, Farizah Saharil, Tommy Haraldsson, 2012 .