Ming-Yao Yen

Enhancement of filling performance of a copper plating formula at low chloride concentration

Wei-Ping Dow, Chen-Chia Huang, Chen‐Chia Huang, 2008 .

Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a Disulfide

Wei-Ping Dow, W. Dow, Ming-Yao Yen, 2009 .

Characterization of Through-Hole Filling by Copper Electroplating Using a Tetrazolium Salt Inhibitor

Wei-Ping Dow, Jhih-Jyun Yan, Su-Mei Huang, 2013 .

Filling mechanism in microvia metallization by copper electroplating

Wei-Ping Dow, W. Dow, Ming-Yao Yen, 2008 .

Influence of convection-dependent adsorption of additives on microvia filling by copper electroplating

Wei-Ping Dow, W. Dow, Ming-Yao Yen, 2005 .

Roles of chloride ion in microvia filling by copper electrodeposition -II. Studies using EPR and galvanostatic measurements

Wei-Ping Dow, W. Dow, Ming-Yao Yen, 2005 .

Influence of Molecular Weight of Polyethylene Glycol on Microvia Filling by Copper Electroplating

Wei-Ping Dow, W. Dow, Ming-Yao Yen, 2005 .

Through-Hole Filling by Copper Electroplating

Wei-Ping Dow, Ryoichi Kimizuka, Wei-Hsiang Chen, 2008 .

Studies of microvia filling mechanism and a novel Cu plating formula

Wei-Ping Dow, Ming-Yao Yen, M.J. Lefebvre, 2007, 2007 International Microsystems, Packaging, Assembly and Circuits Technology.