J H Lau

Development of Large Die Fine-Pitch Cu/Low- $k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Shiguo Liu, Yue Ying Ong, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Design and Development of Multi-Die Laterally Placed and Vertically Stacked Embedded Micro-Wafer-Level Packages

Khong Chee Houe, Lim Ying Ying, V. N. Sekhar, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Development of a Cu/Low-$k$ Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications

C S Premachandran, Leong Ching Wai, Xiaowu Zhang, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.