Ji Chul Yang

Investigation on cu height process control method in BEOL Cu CMP

Daniel Scheffler, Ji Chul Yang, Gerett Yocum, 2015, 2015 International Conference on Planarization/CMP Technology (ICPT).

Post Cleaning for FEOL CMP with Silica and Ceria Slurries

Ji Chul Yang, Wei-Tsu Tseng, Amarnath Jha, 2017 .

The Role of Polysilicon Slurry and Its Application in 7nm CMP

Ji Chul Yang, Haigou Huang, Tai Fong Chao, 2017 .

Effective surface design for reduced scratches on CMP

Daniel Scheffler, Ji Chul Yang, Yong Sik Moon, 2014 .