C.M.L. Wu

Nonlinear analysis of edge effects in angle-ply laminates

C.M.L. Wu, Chi Man Wu, 1987 .

The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements

C. L. Wu, D. Q. Yu, C. Law, 2002 .

Rare-earth additions to lead-free electronic solders

Y. W. Wong, C. L. Wu, C.M.L. Wu, 2006 .

Degradation mechanisms of anisotropic conductive adhesive joints for flip chip on flex applications

Y. C. Chan, K. C. Hung, C. W. Tang, 2000, 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).

Residual shear strength of Sn-Ag and Sn-Bi lead-free SMT joints after thermal shock

Y. C. Chan, Y. Chan, J. Lai, 2000 .

Durability of concrete with high cement replacement

C.M.L. Wu, W.W.J Chan, W.W.J Chan, 2000 .