Guozhong Wang

The effects of underfill and its material models on thermomechanical behaviors of flip chip package

Liu Chen, Z. Cheng, Guozhong Wang, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

Development and application of MC-SN coupled auto-modeling tool RCAM1.0

Pengcheng Long, Qin Zeng, Pengcheng Long, 2011 .

Rate dependent constitutive relations based on Anand model for 92.5Pb5Sn2.5Ag solder

M. Thoben, Jürgen Wilde, J. Wilde, 2000 .

Shutdown dose rate calculation code system and its application to EAST tokamak

Liang Wu, Guozhong Wang, Qi Yang, 2012 .

An integrated system for prediction and analysis of solder interconnection shapes

Chunqing Wang, Shiqin Yang, Guozhong Wang, 2000 .

Computer simulation of three-dimensional castellated solder joint geometry in surface mount technology

Chunqing Wang, Guozhong Wang, Zhaonian Cheng, 1998 .

CAD-based 4D neutronics simulation software for fusion, fission and hybrid systems

Guozhong Wang, Jun Zou, Fds Team, 2012 .