T. Min

Flip Chip Interconnection Systems and its Reliability Performance

A. Yeo, C. Lee, C. Lee, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Effect of substrate warpage on flip chip BGA thermal stress simulation

T. Min, H. Pape, S. Stoeckl, 2010, 2010 12th Electronics Packaging Technology Conference.

Process and materials considerations for Pb-free flip chip packaging of 65nm Cu/low-k device

S. Lim, C. Lee, T. Min, 2006, 2006 8th Electronics Packaging Technology Conference.

Adaptation of brass core lead frame material in IC packaging

T. Min, Koo Kok Kiat, 2010, 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).

Thermodynamic Investigation on Ionic Structure and Electrical Conductivity of Molten NaF-AlF3Salts

Li Tao, T. Min, Shang Zhiqiang, 2020 .

Process development of a flip chip in package with anisotropic conductive film (ACF) for lead-free soldering

C. Lee, T. Min, S. Lim Pei Siang, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

Development of solder replacement flip chip using anisotropic conductive adhesives

C. Lee, T. Min, S.P.-S. Lim, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Application of finite element analysis on flip chip ball grid array package with 65nm Cu/low-κ device

A. Yeo, C. Lee, C. Lee, 2006, 2006 8th Electronics Packaging Technology Conference.

Thermo-mechanical modeling of a 3D flip chip fully populated BGA package

T. Min, H. Pape, C. M. Chai, 2010, 2010 12th Electronics Packaging Technology Conference.