P. Kim

Crystallization of electroless Ni-P under bump metallization induced by solder reaction

D. Frear, K. Tu, J. Jang, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Substrate bias effect of the activated reactive evaporation processed β-SiC thin films

R. Bunshah, H. J. Doerr, P. Kim, 1997 .

Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints

D. Frear, K. Tu, A. Mal, 2000 .

High-temperature lead-free SnSb solders: Wetting reactions on Cu foils and phased-in Cu–Cr thin films

K. Tu, J. Jang, P. Kim, 1999 .

Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils

K. Tu, T. Lee, J. Jang, 1999 .

Kinetic analysis of interfacial diffusion accompanied by intermetallic compound formation

D. Frear, K. Tu, J. Jang, 1999 .

Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology

D. R. Frear, P. Thompson, King-Ning Tu, 1999 .

Morphology of wetting reaction of eutectic SnPb solder on Au foils

K. Tu, P. Kim, 1996 .

Time- and temperature-dependent wetting behavior of eutectic SnPb on Cu leadframes plated with Pd/Ni and Au/Pd/Ni thin films

K. Tu, P. Kim, D. Abbott, 1998 .

Fast soldering reactions on Au foils

K. Tu, P. Kim, 1996 .

Fast dissolution and soldering reactions on Au foils

King-Ning Tu, P. G. Kim, K. Tu, 1998 .

Soldering reaction between eutectic SnPb and plated Pd/Ni thin films on Cu leadframe

K. Tu, P. Kim, D. Abbott, 1997 .