M. Hildebrandt
发表
R. Dudek,
S. Rzepka,
R. Doering,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
R. Dudek,
S. Rzepka,
G. Mitic,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
R. Dudek,
S. Rzepka,
M. Hildebrandt,
2016,
2016 6th Electronic System-Integration Technology Conference (ESTC).
R. Dudek,
G. Schrag,
M. Hildebrandt,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Rzepka,
B. Seiler,
R. Döring,
2018,
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).