R. Ratchev
发表
B. Michel,
R. Dudek,
M. Roellig,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
R. Ratchev,
T. Zerna,
H. Zecha,
2013,
Proceedings of the 36th International Spring Seminar on Electronics Technology.
K. Wolter,
M. Roellig,
K. Meier,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Wiese,
R. Ratchev,
Y. Maniar,
2020,
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
R. Metasch,
X. Schuler,
M. Roellig,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
T. Gottwald,
R. Ratchev,
M. Guyenot,
2017,
Electronic Components and Technology Conference.
T. Gottwald,
R. Ratchev,
D. Maas,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
M. Schneider-Ramelow,
H. Walter,
M. Schmidt,
2019,
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
A. Fix,
J. Wilde,
R. Ratchev,
2013,
2013 Eurpoean Microelectronics Packaging Conference (EMPC).
K. Lang,
T. Beck,
D. Löhe,
2002
.