H. Albrecht

发表

B. Michel, R. Dudek, M. Roellig, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

H. Albrecht, W. Miillera, T. Hannach, 2006, 2006 8th Electronics Packaging Technology Conference.

W. Muller, H. Albrecht, T. Hannach, 2006, 2006 1st Electronic Systemintegration Technology Conference.

H. Albrecht, K. Wilke, P. Fruehauf, 2009 .

H. Albrecht, J. Strogies, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).

K. Suganuma, T. Sugahara, S. Nagao, 2014, Journal of Materials Science: Materials in Electronics.

K. Suganuma, T. Sugahara, S. Nagao, 2012, 2012 2nd IEEE CPMT Symposium Japan.

Katsuaki Suganuma, Shijo Nagao, Hans-Juergen Albrecht, 2016, 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

K. Suganuma, Keun-Soo Kim, H. Albrecht, 2011, 18th European Microelectronics & Packaging Conference.