Kai-Ming Yang
发表
C. Ko,
J. Lau,
Po-Chun Huang,
2021,
Journal of Microelectronics and Electronic Packaging.
G. Luo,
M. Hsieh,
Kai-Ming Yang,
2006
.
John H. Lau,
Puru Bruce Lin,
Cheng-Ta Ko,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
C. Ko,
J. Lau,
Kai-Ming Yang,
2021,
Journal of Microelectronics and Electronic Packaging.
C. Ko,
J. Lau,
Kai-Ming Yang,
2020
.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John H. Lau,
Puru Bruce Lin,
Cheng-Ta Ko,
2020,
International Symposium on Microelectronics.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
J. Lau,
C. Ko,
Po-Chun Huang,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
C. Ko,
Yin-Po Hung,
Kai-Ming Yang,
2016,
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Ming-Feng Hsieh,
Deng-Sung Lin,
Jen-Yang Chung,
2007
.
C. Ko,
J. Lau,
Kai-Ming Yang,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Kuan-Neng Chen,
Yu-Wei Chang,
C. Ko,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
C. Ko,
J. Lau,
Kai-Ming Yang,
2022,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Kuan-Neng Chen,
Yu-Wei Liu,
Han-Wen Hu,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Kai-Ming Yang,
Tim Xia,
Curry Lin,
2023,
IEEE Transactions on Components, Packaging and Manufacturing Technology.