Tim Xia
发表
C. Ko,
J. Lau,
Po-Chun Huang,
2021,
Journal of Microelectronics and Electronic Packaging.
John H. Lau,
Puru Bruce Lin,
Cheng-Ta Ko,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
C. Ko,
J. Lau,
Kai-Ming Yang,
2021,
Journal of Microelectronics and Electronic Packaging.
C. Ko,
J. Lau,
Kai-Ming Yang,
2020
.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John H. Lau,
Puru Bruce Lin,
Cheng-Ta Ko,
2020,
International Symposium on Microelectronics.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
J. Lau,
C. Ko,
Po-Chun Huang,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
C. Ko,
J. Lau,
Kai-Ming Yang,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Kai-Ming Yang,
Tim Xia,
Curry Lin,
2023,
IEEE Transactions on Components, Packaging and Manufacturing Technology.