P. Lin
发表
C. Ko,
J. Lau,
Po-Chun Huang,
2021,
Journal of Microelectronics and Electronic Packaging.
C. Ko,
P. Lin,
Yu-Hua Chen,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
C. Ko,
P. Lin,
Yu-Hua Chen,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
John H. Lau,
Puru Bruce Lin,
Cheng-Ta Ko,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
C. Ko,
J. Lau,
Kai-Ming Yang,
2021,
Journal of Microelectronics and Electronic Packaging.
C. Ko,
J. Lau,
Kai-Ming Yang,
2020
.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John H. Lau,
Puru Bruce Lin,
Cheng-Ta Ko,
2020,
International Symposium on Microelectronics.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
J. Lau,
C. Ko,
Po-Chun Huang,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
C. Ko,
J. Lau,
Kai-Ming Yang,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
C. Ko,
J. Lau,
P. Lin,
2021,
CPMT Symposium Japan.
Yu-Min Lin,
Tao-Chih Chang,
Kuan-Neng Chen,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
A Novel Warpage Reinforcement Architecture with RDL Interposer for Heterogeneous Integrated Packages
Chi-Wei Wang,
Chang-Chun Lee,
Puru Bruce Lin,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Pei-Chen Huang,
Chang-Chun Lee,
Yan-Yu Liou,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).