Tzvy-Jang Tseng

发表

C. Ko, J. Lau, Po-Chun Huang, 2021, Journal of Microelectronics and Electronic Packaging.

John H. Lau, Puru Bruce Lin, Cheng-Ta Ko, 2021, IEEE Transactions on Components, Packaging and Manufacturing Technology.

C. Ko, J. Lau, Kai-Ming Yang, 2021, Journal of Microelectronics and Electronic Packaging.

John H. Lau, Puru Bruce Lin, Cheng-Ta Ko, 2020, International Symposium on Microelectronics.

J. Lau, C. Ko, Kai-Ming Yang, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

J. Lau, C. Ko, Po-Chun Huang, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

J. Lau, J. Huang, Tzvy-Jang Tseng, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).