H. Liu
发表
C. Ko,
J. Lau,
Po-Chun Huang,
2021,
Journal of Microelectronics and Electronic Packaging.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
Ming Li,
J. Huang,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
J. Lau,
H. Liu,
T. Tseng,
2022,
Journal of Microelectronics and Electronic Packaging.
C. Ko,
J. Lau,
Kai-Ming Yang,
2021,
Journal of Microelectronics and Electronic Packaging.
C. Ko,
J. Lau,
Kai-Ming Yang,
2020
.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
J. Lau,
C. Ko,
Po-Chun Huang,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
J. Lau,
Ming Li,
J. Huang,
2023,
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).
J. Lau,
J. Huang,
H. Liu,
2023,
IMAPSource Proceedings.
C. Ko,
J. Lau,
Kai-Ming Yang,
2022,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
J. Huang,
H. Liu,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
J. Huang,
Tzvy-Jang Tseng,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
J. Lau,
J. Huang,
H. Liu,
2021,
International Symposium on Microelectronics.
Kai-Ming Yang,
Tim Xia,
Curry Lin,
2023,
IEEE Transactions on Components, Packaging and Manufacturing Technology.