Yanwei Dai

发表

Haofeng Chen, Yinghua Liu, F. Qin, 2020, International Journal of Mechanical Sciences.

F. Berto, Y. Chao, Yinghua Liu, 2019, International Journal of Solids and Structures.

Haofeng Chen, Yinghua Liu, Yanwei Dai, 2019, International Journal of Computational Methods.

F. Berto, Haofeng Chen, Yinghua Liu, 2021, International Journal of Fracture.

Yinghua Liu, Zhiying Chen, Yanwei Dai, 2022, International Journal of Fatigue.

G. Qian, Yinghua Liu, F. Qin, 2019, Theoretical and Applied Fracture Mechanics.

F. Qin, Yanwei Dai, Tong An, 2019, Microelectronics Reliability.

Minghui Liu, F. Qin, Yanwei Dai, 2022, Surfaces and Interfaces.

F. Qin, Yanwei Dai, Hao Yu, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Yanning Li, F. Qin, Yanwei Dai, 2023, Fatigue & Fracture of Engineering Materials & Structures.

Y. Gong, F. Qin, Yanwei Dai, 2020, Journal of Electronic Materials.

F. Qin, Lingyun Liu, Yanwei Dai, 2021, Journal of Electronic Packaging.

Yinghua Liu, Yanwei Dai, Weicheng Kong, 2022, Engineering Fracture Mechanics.

F. Qin, Yanwei Dai, Tong An, 2022, Journal of Electronic Materials.

F. Qin, Yanwei Dai, Yifan Jin, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

F. Qin, Yanwei Dai, Tong An, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

Yinghua Liu, Yanwei Dai, Weicheng Kong, 2022, Engineering Fracture Mechanics.

Yinghua Liu, Yanwei Dai, Weicheng Kong, 2021, International Journal of Solids and Structures.

Yinghua Liu, Yanwei Dai, Haofeng Chen, 2022, Engineering Failure Analysis.

F. Berto, Yinghua Liu, F. Qin, 2021, International Journal of Fracture.

Yinghua Liu, Zhiying Chen, Yanwei Dai, 2023, International Journal of Fatigue.

F. Qin, Yanwei Dai, Tong An, 2021, IEEE Journal of Emerging and Selected Topics in Power Electronics.

F. Qin, Yanwei Dai, Pei Chen, 2020, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

F. Qin, Lingyun Liu, Yanwei Dai, 2020, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

Wei Liu, Yinghua Liu, Yanwei Dai, 2023, Engineering Fracture Mechanics.

F. Qin, Yanwei Dai, Tong An, 2023, International Journal of Adhesion and Adhesives.

Fei Qin, Shuai Zhao, Yanwei Dai, 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

F. Qin, Yanwei Dai, Tong An, 2020, IEEE Transactions on Device and Materials Reliability.

Yanwei Dai, Weichen Kong, Yinghua Liu, 2024, Engineering Fracture Mechanics.

Yanwei Dai, Jiahui Wei, Libo Zhao, 2023, Fatigue & Fracture of Engineering Materials & Structures.