Pei Chen
发表
Zhao Shuai,
Yan-Hua Gong,
F. Qin,
2021
.
F. Qin,
Tong An,
Pei Chen,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
Daquan Yu,
Chaodong Yang,
F. Qin,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
F. Qin,
Yanwei Dai,
Tong An,
2020
.
Liang Tang,
F. Qin,
Pei Chen,
2015,
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Yanwei Dai,
Tong An,
2019,
Current Applied Physics.
F. Qin,
Tong An,
Pei Chen,
2018
.
F. Qin,
Tong An,
Pei Chen,
2016
.
F. Qin,
Tong An,
Pei Chen,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Tong An,
Pei Chen,
2018,
Journal of Materials Science: Materials in Electronics.
F. Qin,
Pei Chen,
Huiping Yu,
2020
.
Zhiwei Zhang,
F. Qin,
Pei Chen,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Zhiwei Zhang,
F. Qin,
Pei Chen,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Tong An,
Pei Chen,
2016
.
F. Qin,
Pei Chen,
Yadong Li,
2021,
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Yanwei Dai,
Tong An,
2019,
Microelectronics Reliability.
Minghui Liu,
F. Qin,
Yanwei Dai,
2022,
Surfaces and Interfaces.
Chenshuo Liu,
F. Qin,
Pei Chen,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Pei Chen,
Jinglong Sun,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Tong An,
Pei Chen,
2017,
Journal of Electronic Materials.
F. Qin,
Yanwei Dai,
Tong An,
2023,
Materials Science in Semiconductor Processing.
Y. Gong,
F. Qin,
Yanwei Dai,
2020,
Journal of Electronic Materials.
F. Qin,
Pei Chen,
Shaowei Li,
2022,
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Lingyun Liu,
Yanwei Dai,
2021,
Journal of Electronic Packaging.
Yanning Li,
Y. Gong,
F. Qin,
2021,
Materials Science and Engineering: A.
Tao Tang,
Pei Chen,
Chao Fang,
2018,
Microelectron. Reliab..
Pei Chen,
Fei Qin,
Min Zhang,
2019,
Engineering Fracture Mechanics.
F. Qin,
Yanwei Dai,
Tong An,
2021
.
Min Zhang,
F. Qin,
Yanwei Dai,
2023,
IEEE Transactions on Device and Materials Reliability.
F. Qin,
Yanwei Dai,
Tong An,
2022,
Journal of Electronic Materials.
Pei Chen,
Bin Xie,
Fei Qin,
2016,
Microelectron. Reliab..
F. Qin,
Yanwei Dai,
Tong An,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
F. Qin,
Yanwei Dai,
Tong An,
2020
.
Pei Chen,
Fei Qin,
Tong An,
2019,
IEEE Transactions on Power Electronics.
Zhiwei Zhang,
F. Qin,
Tong An,
2018
.
Chenshuo Liu,
Zhiwei Zhang,
F. Qin,
2019,
Modelling and Simulation in Materials Science and Engineering.
Fei Qin,
Quan Xu,
Junfei Ma,
2019,
Langmuir : the ACS journal of surfaces and colloids.
Fei Qin,
Pei Chen,
Zhiwei Zhang,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Yanwei Dai,
Tong An,
2021,
IEEE Journal of Emerging and Selected Topics in Power Electronics.
F. Qin,
Yanwei Dai,
Pei Chen,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Lingyun Liu,
Yanwei Dai,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Yanwei Dai,
Tong An,
2023,
International Journal of Adhesion and Adhesives.
F. Qin,
Yanwei Dai,
Tong An,
2023,
Materials.
F. Qin,
Yanwei Dai,
Tong An,
2020,
IEEE Transactions on Device and Materials Reliability.
Zhiwei Zhang,
F. Qin,
Tong An,
2018,
Japanese Journal of Applied Physics.
Shaolin Xu,
F. Qin,
Pei Chen,
2023,
Journal of Materials Processing Technology.
Chenshuo Liu,
F. Qin,
Pei Chen,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Chenshuo Liu,
Zhiwei Zhang,
Pei Chen,
2022,
Machining and Tribology.
Xiaoxiao Dong,
Quan Xu,
F. Qin,
2020
.
Pei Chen,
Fei Qin,
Tong An,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.