P. Bhatti

Reliability analysis of SnPb and SnAgCu solder joints in FC-BGA packages with thermal enabling preload

Xuejun Fan, Min Pei, Xuejun Fan, 2006, 56th Electronic Components and Technology Conference 2006.

Effect of finite element modeling techniques on solder joint fatigue life prediction of flip-chip BGA packages

Xuejun Fan, Min Pei, Xuejun Fan, 2006, 56th Electronic Components and Technology Conference 2006.

Field condition reliability assessment for SnPb and SnAgCu solder joints in power cycling including mini cycles

Xuejun Fan, Min Pei, Xuejun Fan, 2006, 56th Electronic Components and Technology Conference 2006.

Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices

Pardeep Kumar Bhatti, Klaus Gschwend, Abel Y. Kwang, 1995 .

Probabilistic approach to manipulator kinematics and dynamics

S. S. Rao, P. K. Bhatti, S. S. Rao, 2001, Reliab. Eng. Syst. Saf..