J. Gong
发表
Microstructural features and mechanical behaviour of lead free solders for microelectronic packaging
Jicheng Gong,
J. Gong,
2007
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A. Wilkinson,
I. Jones,
R. Ding,
2016
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A. Wilkinson,
I. Jones,
R. Ding,
2016
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T. B. Britton,
P. Bagot,
D. Rugg,
2014
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A. Wilkinson,
E. Tarleton,
D. Balint,
2015
.
A. Wilkinson,
C. M. Magazzeni,
J. Gong,
2021
.
A. Wilkinson,
I. Jones,
R. Ding,
2012
.
A. Wilkinson,
J. Gong,
2011
.
A. Wilkinson,
C. M. Magazzeni,
J. Gong,
2021,
Fatigue & Fracture of Engineering Materials & Structures.
A. Wilkinson,
T. B. Britton,
F. Dunne,
2015
.
A. Wilkinson,
J. Gong,
2011
.
A. Wilkinson,
J. Gong,
2010
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B. Sankar,
J. Gong,
1991
.
Jicheng Gong,
Angus J. Wilkinson,
A. Wilkinson,
2009
.
A. Wilkinson,
I. Jones,
R. Ding,
2014
.
J. Gong,
H. Chan,
S. Roberts,
2016
.
Paul Conway,
Vadim V. Silberschmidt,
Jicheng Gong,
2006
.
P. Conway,
V. Silberschmidt,
Changqing Liu,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
A. Wilkinson,
T. B. Britton,
F. Dunne,
2016
.
P. Conway,
V. Silberschmidt,
Changqing Liu,
2010
.
P. Conway,
V. Silberschmidt,
Changqing Liu,
2009
.
A. Wilkinson,
F. Dunne,
M. Cuddihy,
2015
.
A. Wilkinson,
E. Tarleton,
J. Gong,
2020
.
P. Conway,
V. Silberschmidt,
Changqing Liu,
2009
.
P. Conway,
V. Silberschmidt,
Changqing Liu,
2007
.
P. Conway,
V. Silberschmidt,
Changqing Liu,
2006,
56th Electronic Components and Technology Conference 2006.
Paul Conway,
Vadim V. Silberschmidt,
Jicheng Gong,
2009
.
Paul Conway,
Vadim V. Silberschmidt,
Jicheng Gong,
2008
.
Paul Conway,
Vadim V. Silberschmidt,
Jicheng Gong,
2008
.
Jicheng Gong,
Angus J. Wilkinson,
A. Wilkinson,
2016
.
Zhao Zhao,
Jicheng Gong,
Nic Li,
2019,
BMVC.