Y. Cheung
发表
J. Lau,
Qinglong Zhang,
Ming Li,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
N. Lee,
J. Lau,
C. Ko,
2017
.
N. Lee,
J. Lau,
C. Ko,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John H. Lau,
Ming Li,
Cao Xi,
2017
.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
N. Lee,
J. Lau,
J. Lo,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
J. Lau,
Qinglong Zhang,
Ming Li,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
P. Liu,
Jang‐Kyo Kim,
M. W. Ng,
2004
.
A. Chong,
Y. Cheung,
2003,
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..
N. Lee,
J. Lau,
J. Lo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Y. Cheung,
Ming Li,
G. Mak,
2012,
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
A. Chong,
B. Huang,
Y. Cheung,
2006,
2006 International Conference on Electronic Materials and Packaging.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
J. Knickerbocker,
S. Skordas,
D. Mcherron,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
J. Lau,
Ming Li,
Y. Cheung,
2015,
Electronic Components and Technology Conference.
K. Yeung,
Y. Cheung,
Zetao Ma,
2014,
Impact.
Ming Li,
Y. Cheung,
Lei Yang,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
J. Lau,
J. Lo,
C. Ko,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
N. Lee,
J. Lau,
J. Lo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Y. Cheung,
S. Or,
A. Sze,
2000,
International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).
Y. Cheung,
S. Or,
S. Ching,
1999,
Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330).
Dishit P. Parekh,
S. Skordas,
D. Mcherron,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
John H. Lau,
Ming Li,
Cao Xi,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Jang‐Kyo Kim,
M. W. Ng,
Deming Liu,
2005,
2005 6th International Conference on Electronic Packaging Technology.
Jang‐Kyo Kim,
M. Wai,
Y. Cheung,
2002,
Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002..