M. Zahn

Stencil Printing of Underfill for Flip Chips on Organic-Panel and Si-Wafer Substrates

J. Lau, Qinglong Zhang, Ming Li, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Stencil printing of underfill for flip chips on organic-panel and Si-wafer assemblies

J. Lau, Qinglong Zhang, Ming Li, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

ATTACC - an Automated Tool for Timing Analysis and Cell Characterization

M. Zahn, Thomas Schwederski, W. Haas, 1990, Rechnergestützter Entwurf und Architektur mikroelektronischer Systeme.

Analysis of Fine-Line Screen and Stencil-Printed Metal Contacts for Silicon Wafer Solar Cells

I. M. Peters, A. Aberle, T. Mueller, 2015, IEEE Journal of Photovoltaics.

Influence of non‐uniform fine lines in silicon solar cell front metal grid design

A. Aberle, T. Mueller, J. Wong, 2015 .