H. Hamdani

Submodeling technique for assessment and numerical prediction of solder jointsfailuresin mechatronic devices

H. Hamdani, B. Radi, A. Elhami, 2016 .

Reliability analysis of tape based chip-scale packages based metamodel

Bouchaib Radi, Hamid Hamdani, Abdelkhalak El Hami, 2019, Microelectronics Reliability.

Metamodel assisted evolution strategies for global optimization of solder joints reliability in embedded mechatronic devices

Hamid Hamdani, Abdelkhalak El Hami, Bouchaïb Radi, 2019, Microsystem Technologies.

Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS© and R

A. Hami, H. Hamdani, B. Radi, 2022 .

Metaheuristic for the RBDO of the brasure's joints of an electronic board

Abdelkhalak El Hami, Bouchaib Radi, Hamid Hamdani, 2018 .