E. Kuah
发表
N. Lee,
J. Lau,
C. Ko,
2017
.
N. Lee,
J. Lau,
C. Ko,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John H. Lau,
Ming Li,
Cao Xi,
2017
.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
E. Kuah,
K. Dabrowiecki,
R. Holly,
2019
.
N. Lee,
J. Lau,
J. Lo,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
N. Fan,
E. Kuah,
Eric Ng,
2019,
Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies.
C. Ko,
R. Beica,
J. Lau,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
N. Lee,
J. Lau,
J. Lo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
C. Ko,
R. Beica,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Wu Kai,
Eric Kuah,
Kuah Teng Hock,
2016,
2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
J. Lau,
J. Lo,
C. Ko,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
J. Lau,
Li Zhang,
K. Tan,
2017,
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
N. Lee,
J. Lau,
J. Lo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
N. Lee,
Lin Jin,
J. Lo,
2018,
International Symposium on Microelectronics.
John H. Lau,
Ming Li,
Cao Xi,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.