Jiang Ran

发表

N. Lee, J. Lau, C. Ko, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

J. Lau, J. Lo, C. Ko, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

J. Lau, J. Lo, C. Ko, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

N. Lee, J. Lau, J. Lo, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

J. Lau, J. Lo, C. Ko, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

N. Lee, J. Lau, J. Lo, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

John H. Lau, Ming Li, Cao Xi, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.