Cao Xi
发表
N. Lee,
J. Lau,
C. Ko,
2017
.
N. Lee,
J. Lau,
C. Ko,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John H. Lau,
Ming Li,
Cao Xi,
2017
.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
N. Lee,
J. Lau,
J. Lo,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
C. Ko,
R. Beica,
J. Lau,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
N. Lee,
J. Lau,
J. Lo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
C. Ko,
R. Beica,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
J. Lau,
J. Lo,
C. Ko,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
N. Lee,
J. Lau,
J. Lo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
N. Lee,
Lin Jin,
J. Lo,
2018,
International Symposium on Microelectronics.
John H. Lau,
Ming Li,
Cao Xi,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.