Q. Yong
发表
N. Lee,
J. Lau,
C. Ko,
2017
.
N. Lee,
J. Lau,
C. Ko,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John H. Lau,
Ming Li,
Cao Xi,
2017
.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
C. Ko,
R. Beica,
J. Lau,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
N. Lee,
J. Lau,
J. Lo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
C. Ko,
R. Beica,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
John H. Lau,
Ming Li,
Cao Xi,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.