F. Akkara

发表

M. Hamasha, S. Hamasha, Sinan Su, 2019, Journal of Electronic Packaging.

P. Lall, S. Hamasha, Sinan Su, 2020, Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

John L. Evans, T. Sanders, Jiawei Zhang, 2020, 2020 Pan Pacific Microelectronics Symposium (Pan Pacific).

P. Lall, B. Prorok, S. Hamasha, 2021, 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).

S. Hamasha, F. Akkara, Mohammed Abueed, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

S. Hamasha, Sinan Su, F. Akkara, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

S. Hamasha, Sinan Su, F. Akkara, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

P. Borgesen, S. Hamasha, Sinan Su, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

P. Borgesen, S. Hamasha, Sinan Su, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

S. Hamasha, F. Akkara, Raed Al Al Athamneh, 2022, Journal of Microelectronics and Electronic Packaging.

P. Lall, S. Hamasha, Sinan Su, 2019, 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

P. Lall, S. Hamasha, Sinan Su, 2019, 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).