Z. Johnson

Underfilled BGAs for ceramic BGA packages and board-level reliability

T. Koschmieder, Z. Johnson, T. Burnette, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Thermal sub-modeling of the wirebonded plastic ball grid array package

K. Ramakrishna, B. Joiner, Z. Johnson, 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

Thermo-mechanical simulation of stacked chip scale packages with moire interferometry vaildation

A. Thoreson, N. Schneck, Z. Johnson, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

THERMO-MECHANICAL SIMULATION OF STACKED CHIP SCALE

A. Thoreson, N. Schneck, Z. Johnson, 2006 .

Underfilled BGAs for a variety of plastic BGA package types and the impact on board-level reliability

T. Burnette, Z. Johnson, T. Koschmieder, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).