Nicholas C. Mitchell
发表
Epoxy Composites with Surface Modified Silicon Carbide Filler for High Temperature Molding Compounds
K. Moon,
C. Wong,
B. Song,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Surendra P. Shah,
Balaguru,
G. J. Venta,
2010
.
Surendra P. Shah,
Arockiasamy,
Secretary,
2022
.