A. Cockburn

发表

J. Wang, W. O'Neill, M. Sparkes, 2015, IEEE International Magnetics Conference.

Eric Beyne, Deniz S. Tezcan, Philippe Soussan, 2011, 2011 IEEE International Interconnect Technology Conference.

G. Beyer, E. Sleeckx, H. Dekkers, 2010, 2010 IEEE International Interconnect Technology Conference.

H. Bender, K. Vandersmissen, H. Philipsen, 2014 .

I. A. Palani, C. Paul, W. O'Neill, 2019, Materials Forming, Machining and Tribology.

William O’Neill, Andrew Cockburn, W. O'Neill, 2009 .

W. O'Neill, M. Sparkes, A. Cockburn, 2022, Coatings.

W. O'Neill, M. Sparkes, A. Cockburn, 2021, Advances in Transdisciplinary Engineering.

R. Lupoi, W. O'Neill, M. Sparkes, 2012, Light: Science & Applications.

E. Beyne, I. De Wolf, K. Croes, 2013, 2013 IEEE International Reliability Physics Symposium (IRPS).

David Richardson, Dejiao Lin, Peh Siong Teh, 2014, IEEE Journal of Selected Topics in Quantum Electronics.

Martin Sparkes, William O’Neill, Andrew Cockburn, 2011 .

Christopher J. Wilson, G. Beyer, E. Sleeckx, 2011 .

R. Delhougne, R. Degraeve, L. Goux, 2019, 2019 IEEE International Electron Devices Meeting (IEDM).

M. Stucchi, I. Ciofi, J. Versluijs, 2009, 2009 IEEE International Interconnect Technology Conference.

C. Ding, W. O'Neill, Rong Liu, 2015, Journal of Thermal Spray Technology.

M. H. van der Veen, N. Jourdan, O. Pedreira, 2022, International Interconnect Technology Conference.

A. Cockburn, M. Bray, B. O’Neill, 2008 .

R. Lupoi, M. Sparkes, A. Cockburn, 2014 .

R. Lupoi, W. O'Neill, M. Sparkes, 2011 .

H. Mertens, P. Leray, G. Lorusso, 2022, Advanced Lithography.