M.Y. Tsai

Thermal resistance and reliability of low-cost high-power LED packages under WHTOL test

C.H. Chen, W.L. Tsai, M.Y. Tsai, 2008, 2008 International Conference on Electronic Materials and Packaging.

Stress and Failure Analysis of a Pin-Loaded Composite Plate: An Experimental Study

M.Y. Tsai, J. Morton, 1990 .

Determination of LED die strength

M. Tsai, C.H. Chen, J.Y. Tang, 2007, 2007 International Conference on Electronic Materials and Packaging.

Thermal analyses and measurements of low-Cost COP package for high-power LED

M. Tsai, C.H. Chen, M.Y. Tsai, 2008, 2008 58th Electronic Components and Technology Conference.

Comparison between Experimental Measurement and Numerical Analysis of Warpage in PBGA Package and Assembly with the Consideration of Residual Strain in the Molding Compound

M. Tsai, Y. Chen, S. Lee, 2006, 2006 International Conference on Electronic Materials and Packaging.

Temperature- and moisture-induced warpages of COG package with non-conductive paste adhesive

M.Y. Tsai, C.Y. Huang, C.Y. Chiang, 2006, 56th Electronic Components and Technology Conference 2006.