Wenqi Zhang

Influence of the processing method on the amount and development of voids in miniaturized interconnections

Ingrid De Wolf, Riet Labie, Bert Verlinden, 2010, 3rd Electronics System Integration Technology Conference ESTC.

High density Cu-Sn TLP bonding for 3D integration

Paresh Limaye, Wouter Ruythooren, Rahul Agarwal, 2009, 2009 59th Electronic Components and Technology Conference.

Effect of thermal annealing on TSV Cu protrusion and local stress

Chongshen Song, Liqiang Cao, Cheng Xu, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits

Eric Beyne, Paul Marchal, Makoto Nagata, 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Cu/Sn microbumps interconnect for 3D TSV chip stacking

Paresh Limaye, Philippe Soussan, Riet Labie, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Impurity Incorporation during Copper Electrodeposition in the Curvature-Enhanced Accelerator Coverage Regime

Karen Maex, Wilfried Vandervorst, M. Van Hove, 2005 .

Fine Pitch Micro-Bump Interconnections for Advanced 3D Chip Stacking

Paresh Limaye, Eric Beyne, Philippe Soussan, 2011 .

Processing aspects to achieve high-end hybrid backside illuminated imagers

Philippe Soussan, Mehmet Akif Erismis, Joeri De Vos, 2010 .

Robust and Low Cost TSV Backside Reveal for 2.5D Multi-Die Integration

Chongshen Song, Liqiang Cao, Lei Wang, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Assembly of 20μm pitch Cu/Sn micro-bumps using high speed capillary self-alignment

P. Soussan, M. Pantouvaki, S. Armini, 2012, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration.