G. Lo

Use-condition-based cyclic bend test development for handheld components

S. Sahasrabudhe, J.P. Sedillo, E. Monroe, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission

C.P. Wong, M. Swaminathan, M. Rotaru, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Electrical design of wafer level package on board for gigabit data transmission

C.P. Wong, M. Swaminathan, M. Rotaru, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).