Chong Liu

发表

Deformation behavior of solid polymer during hot embossing process

Jun Liu, Chong Liu, J. M. Li, 2010 .

Plasma assisted thermal bonding for PMMA microfluidic chips with integrated metal microelectrodes

Junshan Liu, Hongchao Qiao, Liding Wang, 2009 .

Laser-bulge based ultrasonic bonding method for fabricating multilayer thermoplastic microfluidic devices

Jingmin Li, Chong Liu, Jingmin Li, 2017 .

A polydimethylsiloxane electrophoresis microchip with a thickness controllable insulating layer for capacitatively coupled contactless conductivity detection

Fei Xu, Junshan Liu, Liding Wang, 2012 .

Hot embossing/bonding of a poly(ethylene terephthalate) (PET) microfluidic chip

Guoqing Chen, Jingmin Li, Chong Liu, 2007 .

A comblike time-valve used in capillary-driven microfluidic devices

Jingmin Li, Chong Liu, Liang Chao, 2017 .

Evaporation characteristics of micropores in biomimetic micropump

Meng Li, Lei Wang, Jingmin Li, 2014 .

Investigation of adhesion properties between SU-8 photoresist and stainless steel substrate

Liqun Du, Yingli Zhu, Chong Liu, 2011 .

Effect of hot embossing process parameters on polymer flow and microchannel accuracy produced without vacuum

Jingmin Li, Chong Liu, Jingmin Li, 2008 .

Fabrication of a thermoplastic multilayer microfluidic chip

Meng Li, Jingmin Li, Liding Wang, 2012 .

Flexible microassembly methods for micro/nanofluidic chips with an inverted microscope

Junshan Liu, Liding Wang, Chong Liu, 2012 .