Akiteru Ko

Electrical validation of the integration of 193i and DSA for sub-20nm metal cut patterning

Nelson Felix, Jing Guo, Kafai Lai, 2019, Advanced Lithography.

The defect mitigation on EUV stack by track based technology

Nelson Felix, Cody Murray, Karen Petrillo, 2019, Advanced Lithography.

Integrated self-aligned quadruple patterning flow for sub-7nm application

Peter Biolsi, Sophie Thibaut, Eric Liu, 2019, Advanced Lithography.

Line roughness improvements on EUV 36nm pitch pattern by plasma treatment method

Peter Biolsi, Chia-Yun Hsieh, Akiteru Ko, 2019, Advanced Lithography.

Improvement of self-aligned dual patterning using spin-on-carbon mandrel

Peter Biolsi, Sophie Thibaut, Andrew Metz, 2020, Advanced Lithography.

Challenges and mitigation strategies for resist trim etch in resist-mandrel based SAQP integration scheme

Peter Biolsi, Kaushik Kumar, Eric Liu, 2015, Advanced Lithography.