Chia-Pin Chiu

发表

Test chip and substrate design for flip chip microelectronic package thermal measurements

Kankanhalli N. Seetharamu, Teck Joo Goh, Chia-Pin Chiu, 2006 .

Flip Chip Thermal Test Vehicle Design: Requirements, Evaluations, and Validations

Ghulam Abdul Quadir, Kankanhalli N. Seetharamu, Teck Joo Goh, 2003 .

Cooling a Microprocessor Chip

Chia-Pin Chiu, Ravi Mahajan, G. Chrysler, 2006, Proceedings of the IEEE.