Wenjie Liu

Finite element analysis for grinding and lapping of wire-sawn silicon wafers

Zhijian Pei, X. J Xin, Z. Pei, 2002 .

Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers

X. J. Xin, Z. J. Pei, Wenjie Liu, 2004 .