V.S. Rao

Design and Development of Fine Pitch Copper/Low-K Wafer Level Package

V. Kripesh, Seung Wook Yoon, Hnin Wai Yin, 2008, 2008 10th Electronics Packaging Technology Conference.

Process Development and Reliability of Microbumps

V. Kripesh, J. Lau, Hnin Wai Yin, 2008, 2008 10th Electronics Packaging Technology Conference.

High performance embedded RF passive device process integration

V. Kripesh, N. Khan, E.B. Liao, 2008, 2008 58th Electronic Components and Technology Conference.

Development of 3D silicon module with TSV for system in packaging

V. Lee, Ho Soon We, Navas Khan, 2008, 2008 58th Electronic Components and Technology Conference.