Wonseop Choi

Effect of pH on ceria-;silica interactions during chemical mechanical polishing

R. K. Singh, R. Singh, Jeremiah T. Abiade, 2005 .

Fundamentals of Slurry Design for CMP of Metal and Dielectric Materials

G. Bahar Basim, Brij M. Moudgil, B. Moudgil, 2002 .

Roles of Colloidal Silicon Dioxide Particles in Chemical Mechanical Polishing of Dielectric Silicon Dioxide

Wonseop Choi, Rajiv K. Singh, 2005 .