Teng Wang

Embedded Silicon Fan-Out (eSiFO): A Promising Wafer Level Packaging Technology for Multi-chip and 3D System Integration

Daquan Yu, Zhiyi Xiao, Shuying Ma, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Reliability of Ultra-Thin Embedded Silicon Fan-Out (eSiFO) Package Directly Assembled on PCB for Mobile Applications

Lixi Wan, Daquan Yu, Zhiyi Xiao, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).