J.L. Drewniak

Simulation of Via Interconnects Using Physics-Based Models and Microwave Network Parameters

H.-D. Bruns, C. Schuster, R. Rimolo-Donadio, 2008, 2008 12th IEEE Workshop on Signal Propagation on Interconnects.

Analysis of the thermal effects of GaAs FETs under the high-power electromagnetic pulses

Jianfeng Xu, Jun-Fa Mao, Wen-Yan Yin, 2008, 2008 International Conference on Microwave and Millimeter Wave Technology.

Fabrication of Two-Layer Thin-Film Magnetic-Field Microprobes on Freestanding SU-8 Photoepoxy

Kuifeng Hu, Haixiao Weng, J.L. Drewniak, 2010, IEEE Transactions on Device and Materials Reliability.

Signal link-path characterization up to 20 GHz based on a stripline structure

Zhiping Yang, Wheling Cheng, S. Camerlo, 2006, 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..

A concise multiple scattering method for via array analysis in a circular plate pair

J. Fan, Yaojiang Zhang, J.L. Drewniak, 2008, 2008 Electrical Design of Advanced Packaging and Systems Symposium.

Susceptibility characterization of a cavity with an aperture by using slowly rotating EM fields: FDTD analysis and measurements

K. Murano, Y. Kami, Y. Kami, 2004, IEEE Transactions on Electromagnetic Compatibility.

SPICE-Compatible Cavity and Transmission Line Model for Power Bus with Narrow Slots

J.L. Drewniak, Yao Jiang Zhang, Gang Feng, 2007, 2007 IEEE International Symposium on Electromagnetic Compatibility.

Reconstruction of Dispersive Dielectric Properties for PCB Substrates Using a Genetic Algorithm

A. Orlandi, G. Antonini, Zhiping Yang, 2008, IEEE Transactions on Electromagnetic Compatibility.

Analysis of distributed coupling along nonparallel traces using PEEC with phase term expansions

J.L. Drewniak, M.A. Cracraft, 2008, 2008 IEEE International Symposium on Electromagnetic Compatibility.